ABLESTIK JM7000具有高可靠性，低空洞特點(diǎn)，耐高溫可達(dá)370度。

常用超大規(guī)模集成電路封裝，陶瓷焊接封裝和焊接密封封裝

LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1o @ Shear rate 22 s
-1 9,000
Work Life @ 25°C, hours 8 to 16
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350oC. For
applications requiring higher electrical conductivity, a cure cycle of 15
minutes @ 300oC is recommended. Product properties will not be
reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370oC.

TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150oC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300oC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300oC
Chip Size: ROC
15 x 15 mm > 5
漢高北京總代理 Ablestik 貝格斯 道康寧 3M LORD洛德經(jīng)銷商
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BLETHERM 2600AT高導(dǎo)熱導(dǎo)電銀膠 黏 度： 8.5 PaS 剪切強(qiáng)度： - Mpa 工作時(shí)間： 1440 min 工作溫度： - ℃ 保 質(zhì) 期： 12 個(gè)月 固化條件： 30分鐘升到200°C + 15分鐘 @ 200°C 主要應(yīng)用： 大功率LED

HENKEL ABLETHERM 2600AT粘合劑是一款特別為芯片需要高散而開(kāi)發(fā)的芯片粘接膠,如大功率和和散熱元?dú)饧? 本粘合劑是一種特的懸浮液-銀和樹(shù)脂顆粒懸浮在溶劑載體中. 一旦膠水完全固化,溶劑也會(huì)干掉, 本粘合劑含有很高比重的銀. 本品主要用于高功率,高導(dǎo)熱的大功率發(fā)光二極管.

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